1. 2. 3. material content data sheet sales product name ipb80n04s2-h4 issued 29. august 2013 ma# MA000275590 package pg-to263-3-2 weight* 1467.08 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 10.198 0.70 0.70 6951 6951 leadframe non noble metal iron 7439-89-6 0.853 0.06 581 inorganic material phosphorus 7723-14-0 0.256 0.02 174 non noble metal copper 7440-50-8 851.691 58.04 58.12 580536 581291 wire non noble metal aluminium 7429-90-5 6.975 0.48 0.48 4754 4754 encapsulation organic material carbon black 1333-86-4 8.709 0.59 5936 plastics epoxy resin - 95.801 6.53 65301 inorganic material silicondioxide 60676-86-0 476.103 32.45 39.57 324525 395762 leadfinish non noble metal tin 7440-31-5 9.657 0.66 0.66 6582 6582 plating non noble metal nickel 7440-02-0 0.228 0.02 156 inorganic material phosphorus 7723-14-0 0.001 0.00 0.02 0 156 solder noble metal silver 7440-22-4 0.165 0.01 113 non noble metal tin 7440-31-5 0.132 0.01 90 non noble metal lead 7439-92-1 6.310 0.43 0.45 4301 4504 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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